Advanced Materials Technologies 热点文章排行榜Top 10 (2018年2月)

本文统计了Advanced Materials Technologies在2018年2月访问量排在前十位的文章。数据通过Wiley Online Library统计论文页面浏览量(Page Views)得出。

 

1. Fracture-Induced Mechanoelectrical Sensitivities of Paper-Based Nanocomposites

第一作者:Jinyuan Zhang(University of Washington, USA)

通讯作者:Jae-Hyun Chung(University of Washington, USA)

发表时间:26 January 2018

 

2. High-Resolution Patterning and Transferring of Graphene-Based Nanomaterials onto Tape toward Roll-to-Roll Production of Tape-Based Wearable Sensors

通讯作者:Liang Dong(Iowa State University, USA)

发表时间:17 November 2017

 

3. Flexible Interconnects for Electronic Textiles

通讯作者:Tushar K. Ghosh(North Carolina State University, USA)

发表时间:29 January 2018

 

4. 3D Printed Organ Models with Physical Properties of Tissue and Integrated Sensors

第一作者:Kaiyan Qiu(University of Minnesota, USA)

通讯作者:Michael C. McAlpine(University of Minnesota, USA)

Robert M. Sweet(University of Washington, USA;University of Minnesota, USA)

发表时间:6 December 2017

 

5. Rheological Modification of Liquid Metal for Additive Manufacturing of Stretchable Electronics

通讯作者:Yigit Mengüç,Uranbileg Daalkhaijav(Oregon State University, USA)

发表时间:8 February 2018

 

6. Additive Manufacturing of Cellulosic Materials with Robust Mechanics and Antimicrobial Functionality

通讯作者:A. John Hart(Massachusetts Institute of Technology, USA)

发表时间:30 January 2017

 

7. Recent Developments in Graphene-Based Tactile Sensors and E-Skins

第一作者:陈帅(北京科技大学;中科院半导体研究所)

通讯作者:沈国震(中科院半导体研究所)

陈娣(北京科技大学)

姜凯(中国人民解放军总医院)

发表时间:27 December 2017

 

8. DVS-Crosslinked PEDOT:PSS Free-Standing and Textile Electrodes toward Wearable Health Monitoring

通讯作者:Esma Ismailova( Ecole Nationale Supérieure des Mines, France)

David Mecerreyes(POLYMAT University of the Basque Country UPV/EHU, Spain)

发表时间:29 January 2018

 

9. Distributed Feedback Lasers Based on MAPbBr3

通讯作者:Thomas Riedl(University of Wuppertal, Germany)

发表时间:22 January 2018

 

10. A New Printed Electronics Approach Eliminating Redundant Fabrication Process of Vertical Interconnect Accesses: Building Multilayered Circuits in Porous Materials

第一作者:Tengyuan Zhang(Western University, Canada)

通讯作者:Jun Yang(Western University, Canada)

发表时间:8 February 2018

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