Advanced Materials Technologies 热点文章排行榜Top 10 (2017年1月)

本文统计了Advanced Materials Technologies在2017年1月访问量排在前十位的文章。数据通过Wiley Online Library统计论文页面浏览量(Page Views)得出。

 

1. Stepping Toward Self-Powered Papertronics: Integrating Biobatteries into a Single Sheet of Paper

第一作者:Yang Gao( State University of New York-Binghamton, USA)

通讯作者:Seokheun Choi( State University of New York-Binghamton, USA)

发表时间:18 October 2016

 

2. 3D-Printed Autonomous Sensory Composites

通讯作者:Subramanian Sundaram(Massachusetts Institute of Technology, USA)

发表时间:4 January 2017

 

3. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

通讯作者:Muhammad M. Hussain( King Abdullah University of Science and Technology (KAUST), Saudi Arabia)

发表时间:13 October 2016

 

4. Air Processed Inkjet Infiltrated Carbon Based Printed Perovskite Solar Cells with High Stability and Reproducibility

通讯作者:Syed Ghufran Hashmi(Aalto University, Switzerland)

发表时间:7 November 2016

 

5. Paper Skin Multisensory Platform for Simultaneous Environmental Monitoring

通讯作者:Muhammad M. Hussain(King Abdullah University of Science and Technology (KAUST), Saudi Arabia)

发表时间:19 February 2016

 

6. Solvent-Based Soft-Patterning of Graphene Lateral Heterostructures for Broadband High-Speed Metal–Semiconductor–Metal Photodetectors

通讯作者:Tawfique Hasan(University of Cambridge, UK)

徐杨(浙江大学,University of Cambridge, UK)

发表时间:23 December 2016

 

7. 3D-Printing Strong High-Resolution Antioxidant Bioresorbable Vascular Stents

通讯作者:Guillermo Ameer,Cheng Sun(Northwestern University, USA)

发表时间:7 October 2016

 

8. 3D Stretchable, Compressible, and Highly Conductive Metal-Coated Polydimethylsiloxane Sponges

第一作者:Suqing Liang(深圳大学)

通讯作者:刘翼振,周学昌(深圳大学)

发表时间:12 August 2016

 

9. Application of 3D Printing for Smart Objects with Embedded Electronic Sensors and Systems

通讯作者:Ali Javey(University of California, Berkeley, USA)

发表时间:

 

10. Artificially Intelligent Nanoarray for the Detection of Preeclampsia under Real-World Clinical Conditions

通讯作者:Hossam Haick(Technion – Israel Institute of Technology, Israel)

发表时间:30 September 2016

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